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ADP3120A
MAXIMUM RATINGS
Rating
Operating Ambient Temperature, T A
Operating Junction Temperature, T J (Note 1)
Package Thermal Resistance: SO ? 8
Junction ? to ? Case, R q JC
Junction ? to ? Ambient, R q JA (2 ? Layer Board)
Package Thermal Resistance: DFN8 (Note 2)
Junction ? to ? Case, R q JC (From die to exposed pad)
Junction ? to ? Ambient, R q JA
Storage Temperature Range, T S
Value
? 20 to 85
? 20 to 150
45
123
7.5
55
? 65 to 150
Unit
° C
° C
° C/W
° C/W
° C/W
° C/W
° C
Lead Temperature Soldering (10 sec): Reflow (SMD styles only)
JEDEC Moisture Sensitivity Level
Pb ? Free (Note 3)
SO ? 8 (260 peak profile)
260 peak
1
° C
?
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Internally limited by thermal shutdown, 150 ° C min.
2. 2 layer board, 1 in 2 Cu, 1 oz thickness.
3. 60 ? 180 seconds minimum above 237 ° C.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
MAXIMUM RATINGS
Pin Symbol
V CC
PGND
BST
SW
DRVH
DRVL
IN
OD
Pin Name
Main Supply Voltage Input
Ground
Bootstrap Supply Voltage Input
Switching Node
(Bootstrap Supply Return)
High ? Side Driver Output
Low ? Side Driver Output
DRVH and DRVL Control Input
Output Disable
V MAX
15 V
0V
35 V wrt/PGND
40 V < 50 ns wrt/PGND
15 V wrt/SW
35 V
40 V < 50 ns
BST + 0.3 V
V CC + 0.3 V
6.5 V
6.5 V
V MIN
? 0.3 V
0V
? 0.3 V wrt/SW
? 5.0 V
? 10 V < 200 ns
? 0.3 V wrt/SW
? 2.0 V < 200 ns wrt/SW
? 0.3 V DC
? 5.0 V < 200 ns
? 0.3 V
? 0.3 V
NOTE:
All voltages are with respect to PGND except where noted.
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